Thermo-electrical buckling response of actuated functionally graded piezoelectric nanoscale plates

Thermal buckling analysis of ceramic-metal functionally graded plates

Thermal buckling response of functionally graded plates is presented in this paper using sinusoidal shear deformation plate theory (SPT). The material properties of the plate are assumed to vary according to a power law form in the thickness direction. Equilibrium and stability equations are derived based on the SPT. The non-linear governing equations are solved for plates subjected to simply s...

Piezoelectric Actuators for Functionally Graded Plates- Nonlinear Vibration Analysis

Application of Piezoelectric and Functionally Graded Materials in Designing Electrostatically Actuated Micro Switches

In this research, a functionally graded microbeam bonded with piezoelectric layers is analyzed under electric force. Static and dynamic instability due to the electric actuation is studied because of its importance in micro electro mechanical systems, especially in micro switches. In order to prevent pull-in instability, two piezoelectric layers are used as sensor and actuator. A current amplif...

Effect of Non-ideal Boundary Conditions on Buckling of Rectangular Functionally Graded Plates

We have solved the governing equations for the buckling of rectangular functionally graded plates which one of its edges has small non-zero deflection and moment. For the case that the material properties obey a power law in the thickness direction, an analytical solution is obtained using the perturbation series. The applied in-plane load is assumed to be perpendicular to the edge which has no...

Thermal Buckling of Functionally Graded Beams

In this article, thermal stability of beams made of functionally graded material (FGM) is considered. The derivations of equations are based on the one-dimensional theory of elasticity. The material properties vary continuously through the thickness direction. Tanigawa's model for the variation of Poisson's ratio, the modulus of shear stress, and the coefcient of thermal expansion is considered...